KŘÍŽEK Filip Institute of Physics AS CR, v.v.i.

Spoluautoři PIKNA Peter, FEJFAR Antonín

N+-doped silicon substrates were etched by water vapour under the silver nanoparticles acting as a catalyst. Thin silver layer was deposited on two silicon wafers, where one of them was thermally annealed in nitrogen to create silver nanoparticles. Subsequently, both samples were annealed in water vapour and afterwards analysed by Scanning Electron Microscope. The images have shown that the annealed silver nanoparticles burrowed into the silicon substrate in the case of both samples. This new method of silicon etching introduces an alternative way of manufacturing nanohole arrays in silicon substrates.